Aixtron has announced they have sold the first OPTACAP™-200 encapsulation tool to a major Asian display manufacturer.
The standalone R&D system that handles substrate sizes of 200 mm x 200 mm was ordered in the third quarter 2015 and is scheduled for delivery in the first quarter 2016.
The innovative Optacap plasma enhanced chemical vapour deposition (PECVD) technology enables the deposition of highly flexible and effective barrier films for thin-film encapsulation of OLED display, OLED lighting, organic photovoltaic and flexible electronic devices.
According to Aixtron the "groundbreaking" encapsulation technology was the key driver for the company's acquisition of PlasmaSi in April this year. The acquisition has been successfully integrated into the rest of Aixtron's business.
Andreas Toennis, Chief Technology Officer of Aixtron, said, "Thin-film encapsulation is an essential step within the OLED manufacturing process. Therefore, we are delighted to be able to provide an innovative solution to the industry which delivers excellent barrier films at high throughput. Therefore, this solution contributes to a significant reduction of manufacturing costs for the critical encapsulation process step within the production of flexible as well as rigid OLED devices."
